Polyamide-imide (PAI) resin market is expected to reach USD 1.5 Bn by 2027 from USD 1.08 Bn in 2021 at a CAGR of 5.2% during the forecast period.
Polyamide-imide (PAI) resin is a high-performance thermoplastic that is known for its exceptional mechanical, thermal, and chemical properties. It is classified among amorphous high-temperature polymers like polyether ketone, and polyphenylene sulphide, etc., that can be melted, moulded, and treated at consistently elevated temperatures.
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